Memory
Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.
If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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IMC1B1A8C2A2A1E3A8A0000EMMC, 11.5X13 153 BALL, 64GB, -2 |
2,899 |
|
Datasheet | - | 153-VFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 512Gbit | 64G x 8 | eMMC_5.1 | - | - | - | - | -25°C ~ 85°C (TA) | - | - | Surface Mount | 153-FBGA (11.5x13) |
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IMC1B1A8C2A2A1E3A6A0000EMMC, 11.5X13 153 BALL, 32GB, -2 |
3,778 |
|
Datasheet | - | 153-VFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (SLC) | 256Gbit | 32G x 8 | eMMC_5.1 | - | - | - | - | -25°C ~ 85°C (TA) | - | - | Surface Mount | 153-FBGA (11.5x13) |
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IME5132SDBETG-6IECC SDRAM, 512MB, 3.3V, 16MX32, |
3,568 |
|
Datasheet | - | 86-TFSOP (0.400", 10.16mm Width) | Tray | Active | - | Volatile | DRAM | SDRAM | 512Mbit | 16M x 32 | LVTTL | 166 MHz | - | 5.4 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 86-TSOP II |
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IMAG32L4JCBG-046LPDDR4X 16GB 512MX32 2133MHZ FBG |
2,561 |
|
Datasheet | - | 200-VFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | 512M x 32 | Parallel | 2.133 GHz | 18ns | - | 1.17V ~ 1.06V, 1.95V ~ 1.7V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 200-FBGA (10x15) |
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IMAG16L4JCDG-046LPDDR4X 16GB 1024MX16 2133MHZ FB |
1,900 |
|
Datasheet | - | 200-VFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | 1G x 16 | Parallel | 2.133 GHz | 18ns | - | 1.17V ~ 1.06V, 1.95V ~ 1.7V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 200-FBGA (10x15) |
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IMAG32L4JCBG-046ILPDDR4X 16GB 512MX32 2133MHZ FBG |
3,110 |
|
Datasheet | - | 200-VFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | 512M x 32 | Parallel | 2.133 GHz | 18ns | - | 1.17V ~ 1.06V, 1.95V ~ 1.7V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 200-FBGA (10x15) |
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IMAG16L4JCDG-046ILPDDR4X 16GB 1024MX16 2133MHZ FB |
1,629 |
|
Datasheet | - | 200-VFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | 1G x 16 | Parallel | 2.133 GHz | 18ns | - | 1.17V ~ 1.06V, 1.95V ~ 1.7V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 200-FBGA (10x15) |
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IM2G04D2DBBG-25DDR2 2GB, 1.8V, 512MX4, 400MHZ ( |
2,867 |
|
Datasheet | - | 60-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - DDR2 | 2Gbit | 512M x 4 | SSTL_18 | 400 MHz | 15ns | 400 ps | 1.7V ~ 1.9V | 0°C ~ 95°C (TC) | - | - | Surface Mount | 60-FBGA (8x10) |
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IM8G08D3FFDG-125DDR3 8GB, 1.35V/1.5V, 1GX8 (2CS) |
4,004 |
|
Datasheet | - | 78-LFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - DDR3L | 8Gbit | 1G x 8 | Parallel | 800 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 78-FBGA (9x10.6) |
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IM8G16D3FFDG-107DDR3 8GB, 1.35V/1.5V, 512MX16 (2 |
2,421 |
|
Datasheet | - | 96-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - DDR3L | 8Gbit | 512M x 16 | Parallel | 933 MHz | 15ns | 20 ns | 1.283V ~ 1.45V | 0°C ~ 95°C (TC) | - | - | Surface Mount | 96-FBGA (9x13.5) |
Frequently Asked Questions
What are Memory components used for?
Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Memory part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
