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ELECTRONIC COMPONENTS

Memory

Explore Memory parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Programmable Memory Type Memory Format Technology Memory Size Memory Organization Memory Interface Clock Frequency Write Cycle Time - Word, Page Access Time Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
AS7C31026C-10BINTR Alliance Memory, Inc.

AS7C31026C-10BINTR

IC SRAM 1MBIT PARALLEL 48BGA

Alliance Memory, Inc.

3,230
Datasheet - 48-LFBGA Tape & Reel (TR) Obsolete Not Verified Volatile SRAM SRAM - Asynchronous 1Mbit 64K x 16 Parallel - 10ns 10 ns 3V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 48-BGA (7x7)
AS7C31025C-12TJINTR Alliance Memory, Inc.

AS7C31025C-12TJINTR

IC SRAM 1MBIT PARALLEL 32SOJ

Alliance Memory, Inc.

1,873
Datasheet - 32-BSOJ (0.300", 7.62mm Width) Tape & Reel (TR) Obsolete Not Verified Volatile SRAM SRAM - Asynchronous 1Mbit 128K x 8 Parallel - 12ns 12 ns 3V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 32-SOJ
W25N01GVZEIT TR Winbond Electronics

W25N01GVZEIT TR

IC FLASH 1GBIT SPI 104MHZ 8WSON

Winbond Electronics

2,674
Datasheet SpiFlash® 8-WDFN Exposed Pad Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH - NAND 1Gbit 128M x 8 SPI 104 MHz - - 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 8-WSON (8x6)
W25N01KWZEIE TR Winbond Electronics

W25N01KWZEIE TR

1GB SERIAL NAND FLASH, 1.8V, B

Winbond Electronics

2,754
Datasheet - - Tape & Reel (TR) Active - - - - - - - - - - - - - - - -
W25N01KWZEIT TR Winbond Electronics

W25N01KWZEIT TR

1GB SERIAL NAND FLASH, 1.8V, BU

Winbond Electronics

4,747
Datasheet - - Tape & Reel (TR) Active - - - - - - - - - - - - - - - -
W25N01KWZEIG TR Winbond Electronics

W25N01KWZEIG TR

1GB SERIAL NAND FLASH, 1.8V, BU

Winbond Electronics

2,472
Datasheet - - Tape & Reel (TR) Active - - - - - - - - - - - - - - - -
W25N01KWZEIR TR Winbond Electronics

W25N01KWZEIR TR

1GB SERIAL NAND FLASH, 1.8V, BUF

Winbond Electronics

1,121
Datasheet - - Tape & Reel (TR) Active - - - - - - - - - - - - - - - -
W25N01KWZEIU TR Winbond Electronics

W25N01KWZEIU TR

1GB SERIAL NAND FLASH, 1.8V, BU

Winbond Electronics

1,190
Datasheet - - Tape & Reel (TR) Active - - - - - - - - - - - - - - - -
GD25LF255EWIGR GigaDevice Semiconductor (HK) Limited

GD25LF255EWIGR

IC FLASH 256MBIT SPI/QUAD 8WSON

GigaDevice Semiconductor (HK) Limited

1,586
Datasheet GD25LF 8-WDFN Exposed Pad Tape & Reel (TR) Active - Non-Volatile FLASH FLASH - NOR (SLC) 256Mbit 32M x 8 SPI - Quad I/O, QPI, DTR 166 MHz - - 1.65V ~ 2V -40°C ~ 85°C (TA) - - Surface Mount 8-WSON (5x6)
GD5F1GM7UEYJGR GigaDevice Semiconductor (HK) Limited

GD5F1GM7UEYJGR

IC FLASH 1GBIT SPI/QUAD

GigaDevice Semiconductor (HK) Limited

3,360
Datasheet GD5F 8-WDFN Exposed Pad Tape & Reel (TR) Active - Non-Volatile FLASH FLASH - NAND (SLC) 1Gbit 256M x 4 SPI - Quad I/O, DTR 133 MHz 600µs 7 ns 2.7V ~ 3.6V -40°C ~ 105°C (TA) - - Surface Mount 8-WSON (6x8)
CY62256LL-70PC Infineon Technologies

CY62256LL-70PC

IC SRAM 256KBIT PARALLEL 28DIP

Infineon Technologies

3,044
Datasheet MOBL™ 28-DIP (0.600", 15.24mm) Tube Obsolete Not Verified Volatile SRAM SRAM - Asynchronous 256Kbit 32K x 8 Parallel - 70ns 70 ns 4.5V ~ 5.5V 0°C ~ 70°C (TA) - - Through Hole 28-PDIP
SST39SF020A-55-4C-NHE-T Microchip Technology

SST39SF020A-55-4C-NHE-T

IC FLASH 2MBIT PARALLEL 32PLCC

Microchip Technology

4,139
Datasheet SST39 MPF™ 32-LCC (J-Lead) Tape & Reel (TR) Active Not Verified Non-Volatile FLASH FLASH 2Mbit 256K x 8 Parallel - 20µs 55 ns 4.5V ~ 5.5V 0°C ~ 70°C (TA) - - Surface Mount 32-PLCC (11.43x13.97)
W632GU6RB-09 TR Winbond Electronics

W632GU6RB-09 TR

2GB DDR3L 1.35V SDRAM, X16, 1066

Winbond Electronics

2,565
Datasheet - 96-VFBGA Tape & Reel (TR) Active - Volatile DRAM SDRAM - DDR3L 2Gbit 128M x 16 Parallel 1.066 MHz 15ns 20 ns 1.283V ~ 1.45V -40°C ~ 95°C (TC) - - Surface Mount 96-VFBGA (7.5x13)
71V016SA20PHGI Renesas Electronics Corporation

71V016SA20PHGI

IC SRAM 1MBIT PARALLEL 44TSOP II

Renesas Electronics Corporation

3,407
Datasheet - 44-TSOP (0.400", 10.16mm Width) Tube Obsolete Not Verified Volatile SRAM SRAM - Asynchronous 1Mbit 64K x 16 Parallel - 20ns 20 ns 3V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 44-TSOP II
W632GU8RB-11 TR Winbond Electronics

W632GU8RB-11 TR

2GB DDR3L 1.35V SDRAM, X8, 933MH

Winbond Electronics

4,339
Datasheet - 78-VFBGA Tape & Reel (TR) Active - Volatile DRAM SDRAM - DDR3 2Gbit 256M x 8 Parallel - 15ns 20 ns 1.283V ~ 1.45V 0°C ~ 95°C (TC) - - Surface Mount 78-VFBGA (8x10.5)
MB85RC64VPNF-G-JNE1 Fujitsu Semiconductor Memory Solution

MB85RC64VPNF-G-JNE1

IC FRAM 64KBIT I2C 8SOP

Fujitsu Semiconductor Memory Solution

2,477
Datasheet - 8-SOIC (0.154", 3.90mm Width) Tube Active Not Verified Non-Volatile FRAM FRAM (Ferroelectric RAM) 64Kbit 8K x 8 I2C 1 MHz - 550 ns 3V ~ 5.5V -40°C ~ 85°C (TA) - - Surface Mount 8-SOP
AT29C020-70JU-T Microchip Technology

AT29C020-70JU-T

IC FLASH 2MBIT PARALLEL 32PLCC

Microchip Technology

2,366
Datasheet - 32-LCC (J-Lead) Tape & Reel (TR) Obsolete Not Verified Non-Volatile FLASH FLASH 2Mbit 256K x 8 Parallel - 10ms 70 ns 4.5V ~ 5.5V -40°C ~ 85°C (TC) - - Surface Mount 32-PLCC (13.97x11.43)
AT29C020-90JU-T Microchip Technology

AT29C020-90JU-T

IC FLASH 2MBIT PARALLEL 32PLCC

Microchip Technology

3,403
Datasheet - 32-LCC (J-Lead) Tape & Reel (TR) Obsolete Not Verified Non-Volatile FLASH FLASH 2Mbit 256K x 8 Parallel - 10ms 90 ns 4.5V ~ 5.5V -40°C ~ 85°C (TC) - - Surface Mount 32-PLCC (13.97x11.43)
GD25B256EWIGY GigaDevice Semiconductor (HK) Limited

GD25B256EWIGY

IC FLASH 256MBIT SPI/QUAD 8WSON

GigaDevice Semiconductor (HK) Limited

4,914
Datasheet GD25B 8-WDFN Exposed Pad Tray Active - Non-Volatile FLASH FLASH - NOR (SLC) 256Mbit 32M x 8 SPI - Quad I/O - - - 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 8-WSON (5x6)
GD25B256EWIGR GigaDevice Semiconductor (HK) Limited

GD25B256EWIGR

IC FLASH 256MBIT SPI/QUAD

GigaDevice Semiconductor (HK) Limited

1,362
Datasheet GD25B 8-WDFN Exposed Pad Tray Active - Non-Volatile FLASH FLASH - NOR (SLC) 256Mbit 32M x 8 SPI - Quad I/O 133 MHz 90µs, 2ms 7 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 8-WSON (5x6)
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FAQ

Frequently Asked Questions

What are Memory components used for?

Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Memory part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

Need Pricing or Stock Support for Memory?

Submit your required part numbers, manufacturers and quantities to receive stock availability, pricing, lead-time and sourcing support. Our team assists with active components, shortage parts, obsolete models and one-stop BOM procurement.

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