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FILTERED COMPONENT SELECTION

Memory

Review Memory Memory components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Programmable Memory Type Memory Format Technology Memory Size Memory Organization Memory Interface Clock Frequency Write Cycle Time - Word, Page Access Time Voltage - Supply Operating Temperature Grade Qualification Mounting Type Supplier Device Package
GD25F128FBARR GigaDevice Semiconductor (HK) Limited

GD25F128FBARR

IC FLASH

GigaDevice Semiconductor (HK) Limited

1,108
Datasheet - - Tape & Reel (TR) Active - - FLASH FLASH - NOR - - - - - - - - - - - -
GD25LB256EFIRR GigaDevice Semiconductor (HK) Limited

GD25LB256EFIRR

IC FLASH 256MBIT SPI/QUAD 16SOP

GigaDevice Semiconductor (HK) Limited

1,638
Datasheet GD25LB 16-SOIC (0.295", 7.50mm Width) Tape & Reel (TR) Active - Non-Volatile FLASH FLASH - NOR (SLC) 256Mbit 32M x 8 SPI - Quad I/O, QPI, DTR 166 MHz 70µs, 1.2ms 6 ns 1.65V ~ 2V -40°C ~ 85°C (TA) - - Surface Mount 16-SOP
GD9FU1G8F2DDGI GigaDevice Semiconductor (HK) Limited

GD9FU1G8F2DDGI

IC FLASH 1GBIT PAR 48FBGA

GigaDevice Semiconductor (HK) Limited

4,835
Datasheet GD9F 48-VFBGA Tray Active - Non-Volatile FLASH FLASH - NAND (SLC) 1Gbit 128M x 8 ONFI - 12ns, 600µs 9 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 48-FBGA (6x8)
GD9FU1G8F2DMGI GigaDevice Semiconductor (HK) Limited

GD9FU1G8F2DMGI

IC FLASH 1GBIT PAR 48TSOPI

GigaDevice Semiconductor (HK) Limited

4,215
Datasheet GD9F 48-TFSOP (0.724", 18.40mm Width) Tray Active - Non-Volatile FLASH FLASH - NAND (SLC) 1Gbit 128M x 8 ONFI - 12ns, 600µs 9 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 48-TSOP I
GD5F1GM7REWIGR GigaDevice Semiconductor (HK) Limited

GD5F1GM7REWIGR

IC FLASH 1GBIT SPI/QUAD

GigaDevice Semiconductor (HK) Limited

3,405
Datasheet GD5F 8-WDFN Exposed Pad Tape & Reel (TR) Active - Non-Volatile FLASH FLASH - NAND (SLC) 1Gbit 256M x 4 SPI - Quad I/O, DTR 104 MHz 600µs 9 ns 1.7V ~ 2V -40°C ~ 85°C (TA) - - Surface Mount 8-WSON (5x6)
GD5F1GQ5UEBIGY GigaDevice Semiconductor (HK) Limited

GD5F1GQ5UEBIGY

IC FLASH 1GBIT SPI/QUAD

GigaDevice Semiconductor (HK) Limited

1,891
Datasheet GD5F 24-TBGA Tray Active - Non-Volatile FLASH FLASH - NAND (SLC) 1Gbit 128M x 8 SPI - Quad I/O, DTR 133 MHz 600µs 7 ns 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 24-TFBGA (6x8)
GD5F1GQ5REWIGR GigaDevice Semiconductor (HK) Limited

GD5F1GQ5REWIGR

IC FLASH 1GBIT SPI/QUAD

GigaDevice Semiconductor (HK) Limited

2,153
Datasheet GD5F 8-WDFN Exposed Pad Tape & Reel (TR) Active - Non-Volatile FLASH FLASH - NAND (SLC) 1Gbit 256M x 4 SPI - Quad I/O, QPI, DTR 104 MHz 600µs 9.5 ns 1.7V ~ 2V -40°C ~ 85°C (TA) - - Surface Mount 8-WSON (5x6)
GD5F1GQ5REYIHY GigaDevice Semiconductor (HK) Limited

GD5F1GQ5REYIHY

IC FLASH 1GBIT SPI/QUAD

GigaDevice Semiconductor (HK) Limited

2,683
Datasheet GD5F 8-WDFN Exposed Pad Tray Active - Non-Volatile FLASH FLASH - NAND (SLC) 1Gbit 256M x 4 SPI - Quad I/O, DTR 104 MHz 600µs 9.5 ns 1.7V ~ 2V -40°C ~ 85°C (TA) - - Surface Mount 8-WSON (6x8)
GD5F1GQ5REYIGY GigaDevice Semiconductor (HK) Limited

GD5F1GQ5REYIGY

IC FLASH 1GBIT SPI/QUAD

GigaDevice Semiconductor (HK) Limited

3,330
Datasheet GD5F 8-WDFN Exposed Pad Tray Active - Non-Volatile FLASH FLASH - NAND (SLC) 1Gbit 256M x 4 SPI - Quad I/O, QPI, DTR 104 MHz 600µs 9.5 ns 1.7V ~ 2V -40°C ~ 85°C (TA) - - Surface Mount 8-WSON (6x8)
GD25Q256EFIRY GigaDevice Semiconductor (HK) Limited

GD25Q256EFIRY

IC FLASH 256MBIT SPI/QUAD 16SOP

GigaDevice Semiconductor (HK) Limited

3,705
Datasheet GD25Q 16-SOIC (0.295", 7.50mm Width) Tray Active - Non-Volatile FLASH FLASH - NOR (SLC) 256Mbit 32M x 8 SPI - Quad I/O 133 MHz - - 2.7V ~ 3.6V -40°C ~ 85°C (TA) - - Surface Mount 16-SOP
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FAQ

Frequently Asked Questions

What are Memory components used for?

Memory components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right Memory part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find Memory parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right Memory Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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