System On Chip (SoC)

Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Package/Case	Packaging	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Grade	Qualification	Supplier Device Package
M2S010TS-1FG484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	2,701	78.61	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 10K Logic Modules	-40°C ~ 100°C (TJ)	-	-	484-FPBGA (23x23)
PLCHIP-P13-51220X1 P13 PLC ON A CHIP SINGLE, LQFP-2 Divelbiss Corporation	4,490	78.08	RFQ	Datasheet	-	208-LQFP	Box	Active	MCU	PLC	256KB	32KB	LCD, PWM, WDT	CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART	12MHz	-	-40°C ~ 85°C (TJ)	-	-	208-LQFP (28x28)
XC7Z007S-2CLG225I IC SOC CORTEX-A9 766MHZ 225BGA AMD	1,911	64.33	RFQ	Datasheet	Zynq®-7000	225-LFBGA, CSPBGA	Tray	Active	MCU, FPGA	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	766MHz	Artix™-7 FPGA, 23K Logic Cells	-40°C ~ 100°C (TJ)	-	-	225-CSPBGA (13x13)
BCM55045B1IFSBG 10G XPON DPU CHIP Broadcom Limited	4,453	99.40	RFQ	Datasheet	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-	-	-
DRA829VMTGBALFR DUAL ARM CORTEX-A72, QUAD CORTEX Texas Instruments	3,532	79.49	RFQ	Datasheet	-	827-BFBGA, FCBGA	Tape & Reel (TR)	Last Time Buy	DSP, MCU, MPU	ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x	-	1.5MB	DMA, PWM, WDT	MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB	2GHz, 1GHz, 1.35GHz, 1GHz	-	-40°C ~ 105°C (TJ)	Automotive	AEC-Q100	827-FCBGA (24x24)
R8A77980ALA01BA#GE SOC R-CAR V3H2-U2 Renesas Electronics Corporation	3,304	0.00	RFQ	Datasheet	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-	-	-
A2F500M3G-1CSG288 IC SOC CORTEX-M3 100MHZ 288CSP Microchip Technology	4,924	81.54	RFQ	Datasheet	SmartFusion®	288-TFBGA, CSPBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	100MHz	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	0°C ~ 85°C (TJ)	-	-	288-CSP (11x11)
A2F500M3G-1CS288 IC SOC CORTEX-M3 100MHZ 288CSP Microchip Technology	1,707	81.54	RFQ	Datasheet	SmartFusion®	288-TFBGA, CSPBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	100MHz	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	0°C ~ 85°C (TJ)	-	-	288-CSP (11x11)
M2S025-FG484 IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	4,766	81.80	RFQ	Datasheet	SmartFusion®2	484-BGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	484-FPBGA (23x23)
M2S025T-1FCS325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	1,707	82.23	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x11)
M2S025T-1FCSG325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	1,239	82.23	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x11)
M2S025T-FCS325I IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	4,075	82.23	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	-	-	325-FCBGA (11x11)
M2S025T-FCSG325I IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	3,659	82.23	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	-	-	325-FCBGA (11x11)
M2S025TS-FCS325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	1,068	82.23	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x11)
M2S025TS-FCSG325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	1,367	82.23	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-FCBGA (11x11)
R8A779M4JXXXBG#GH R-CAR M3NE Renesas Electronics Corporation	2,629	0.00	RFQ	Datasheet	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-	-	-
R8A779M5JXXXBG#GH R-CAR M3NE-2G Renesas Electronics Corporation	4,043	0.00	RFQ	Datasheet	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-	-	-
A2F500M3G-1FG256 IC SOC CORTEX-M3 100MHZ 256FBGA Microchip Technology	3,330	82.74	RFQ	Datasheet	SmartFusion®	256-LBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	100MHz	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	0°C ~ 85°C (TJ)	-	-	256-FPBGA (17x17)
A2F500M3G-CS288I IC SOC CORTEX-M3 80MHZ 288CSP Microchip Technology	3,523	83.86	RFQ	Datasheet	SmartFusion®	288-TFBGA, CSPBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-40°C ~ 100°C (TJ)	-	-	288-CSP (11x11)
M2S025-1FCS325I IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	2,624	85.27	RFQ	Datasheet	SmartFusion®2	325-TFBGA, FCBGA	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	-	-	325-FCBGA (11x11)

FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.