System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MPFS250T-FCSG536EESIC SOC RISC-V 536LFBGA |
1,168 |
|
Datasheet | PolarFire® | 536-LFBGA, CSPBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | 0°C ~ 100°C | - | - | 536-LFBGA |
|
MPFS460T-FCG1152EPPIC SOC RISC-V 1152FCBGA |
1,733 |
|
Datasheet | PolarFire® | 1152-BBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 3.95MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 461K Logic Modules | 0°C ~ 100°C | - | - | 1152-FCBGA (35x35) |
|
MPFS250T-FCVG484EESIC SOC RISC-V 484FCBGA |
4,164 |
|
Datasheet | PolarFire® | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | 0°C ~ 100°C | - | - | 484-FCBGA (19x19) |
|
MPFS460TS-FC1152MIC SOC RISC-V 1152FCBGA |
2,621 |
|
Datasheet | PolarFire® | 1152-BBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 3.95MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 461K Logic Modules | - | - | - | 1152-FCBGA (35x35) |
|
NCN5140STXGKNX WALL SWITCH SYSTEM-IN-PACKAG |
3,611 |
|
Datasheet | - | 64-VFQFN Exposed Pad | Tape & Reel (TR) | Obsolete | MCU | ARM® Cortex®-M0+ | - | - | - | SPI, UART/USART | - | - | -40°C ~ 85°C (TA) | - | - | PG-VQFN-64-8 |
|
MPFS095T-1FCVG484T2IC SOC RISC-V 484FCBGA |
1,194 |
|
Datasheet | PolarFire® | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128KB | 857.6KB | DMA, PCI, PWM | CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 93K Logic Modules | -40°C ~ 125°C (TJ) | - | - | 484-FCBGA (19x19) |
|
MPFS250T-FCVG784T2IC SOC RISC-V 784FCBGA |
2,136 |
|
Datasheet | PolarFire® | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128KB | 2.2MB | DMA, PCI, PWM | CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 125°C (TJ) | - | - | 784-FCBGA (23x23) |
|
SOM-2532CCBX-S5A1SBC 1.5GHZ 4 CORE 0GB/8GB RAM |
2,101 |
|
Datasheet | SMARC | Module | Bulk | Obsolete | MPU | Intel® Atom® x6413E | 32GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.5GHz | - | -40°C ~ 85°C | - | - | - |
|
MPFS095T-FCSG536T2IC SOC RISC-V 536BGA |
3,096 |
|
Datasheet | PolarFire® | 536-LFBGA | Tray | Active | MPU, FPGA | RISC-V | 128KB | 857.6KB | DMA, PCI, PWM | CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 93K Logic Modules | -40°C ~ 125°C (TJ) | - | - | 536-BGA (16x16) |
|
MPFS250T-1FCVG484T2IC SOC RISC-V 484FCBGA |
4,180 |
|
Datasheet | PolarFire® | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128KB | 2.2MB | DMA, PCI, PWM | CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 125°C (TJ) | - | - | 484-FCBGA (19x19) |
|
MPFS095T-1FCSG536T2IC SOC RISC-V 536BGA |
2,611 |
|
Datasheet | PolarFire® | 536-LFBGA | Tray | Active | MPU, FPGA | RISC-V | 128KB | 857.6KB | DMA, PCI, PWM | CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 93K Logic Modules | -40°C ~ 125°C (TJ) | - | - | 536-BGA (16x16) |
|
MPFS250T-1FCSG536T2IC SOC RISC-V 536BGA |
3,514 |
|
Datasheet | PolarFire® | 536-LFBGA | Tray | Active | MPU, FPGA | RISC-V | 128KB | 2.2MB | DMA, PCI, PWM | CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 125°C (TJ) | - | - | 536-BGA (16x16) |
|
R8A77610DA01BGV#U9IC MCU |
4,737 |
|
Datasheet | - | 449-FBGA | Bulk | Obsolete | MPU | SH-4A | - | 16KB | DDR | CANbus, I2C, USB | 400MHz | - | - | - | - | 449-FBGA (21x21) |
|
FHCE2734-R3TNMODULE |
4,144 |
|
Datasheet | - | - | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
URX850B1BEMODULE |
1,511 |
|
Datasheet | AnyWAN™ | 837-BGA, FCBGA | Bulk | Active | MPU | Intel® Atom™ | - | - | SATA, SGMII, USXGMII, XFI | MMC, PCIe, USB | 2GHz | - | - | - | - | 837-FCBGA (24x26) |
|
MPFS095TS-FCS325MMPFS095TS-FCS325M |
2,125 |
|
Datasheet | PolarFire® | 325-LFBGA, FC | Tray | Active | MPU, FPGA | RISC-V | 128KB | 857.6KB | DMA, PCI, PWM | CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 93K Logic Modules | -55°C ~ 125°C (TJ) | - | - | 325-FCBGA (11x14.5) |
|
TDA4VM88TRBALFQ1PROTOTYPE |
1,090 |
|
Datasheet | - | 827-BFBGA, FCBGA | Bulk | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 125°C (TJ) | - | - | 827-FCBGA (24x24) |
|
TDA2HVBDQABCRQ1SOC PROCESSOR W/ VIDEO & VISION |
2,077 |
|
Datasheet | - | 760-BFBGA, FCBGA | Tray | Active | DSP, MPU | ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x | - | 2.5MB | DMA, POR, PWM, WDT | CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB | 500MHz | - | -40°C ~ 125°C (TJ) | - | - | 760-FCBGA (23x23) |
|
TDA3MDDBABFQ1LOW POWER SOC W/ FULL-FEATURED P |
2,117 |
|
Datasheet | - | 367-BFBGA, FCBGA | Tape & Reel (TR) | Active | DSP, MPU | ARM® Cortex®-M4, C66x | - | 512kB | DMA, POR, PWM, WDT | CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB | 212.8MHz, 500MHz | - | -40°C ~ 125°C (TJ) | - | - | 367-FCBGA (15x15) |
|
BCM11350KFEBGVOIP PART, 1.25GHZ, 3D, 17X17 FC |
3,351 |
|
Datasheet | - | - | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.