System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
M2S025TS-1VFG256T2IC SOC CORTEX-M3 166MHZ 256FBGA |
2,413 |
|
Datasheet | SmartFusion®2 | 256-LBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 256-FPBGA (17x17) |
|
M2S025TS-1VFG400T2IC SOC CORTEX-M3 166MHZ 400VFBGA |
3,514 |
|
Datasheet | SmartFusion®2 | 400-LFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 400-VFBGA (17x17) |
|
M2S060TS-1FGG484T2IC SOC CORTEX-M3 166MHZ 484FBGA |
1,331 |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 484-FPBGA (23x23) |
|
M2S060TS-1FGG676T2IC SOC CORTEX-M3 166MHZ 676FBGA |
3,114 |
|
Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 676-FBGA (27x27) |
|
|
M2S060TS-1VFG400T2IC SOC CORTEX-M3 166MHZ 400VFBGA |
2,577 |
|
Datasheet | SmartFusion®2 | 400-LFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 60K Logic Modules | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 400-VFBGA (17x17) |
|
|
M2S090TS-1FGG484T2IC SOC CORTEX-M3 166MHZ 484FBGA |
2,544 |
|
Datasheet | SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 484-FPBGA (23x23) |
|
|
M2S090TS-1FGG676T2IC SOC CORTEX-M3 166MHZ 676FBGA |
3,991 |
|
Datasheet | SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 676-FBGA (27x27) |
|
BCM3380DIFSBGDOCSIS 3.0 DATA MODEM I-TEMP |
3,321 |
|
Datasheet | * | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
BCM3380EKFSBGDOCSIS 3.0 EMTA |
3,633 |
|
Datasheet | * | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
BCM3380GKFSBGDOCSIS 3.0 DATA GATEWAY |
3,204 |
|
Datasheet | * | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
BCM3380MIFSBGDOCSIS 3.0 STB FRONT END I-TEMP |
4,120 |
|
Datasheet | * | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
BCM3380ZKFEBGDOCSIS 3.0 VOICE GATEWAY |
1,987 |
|
Datasheet | * | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
BCM3380ZKFSBGDOCSIS 3.0 VOICE GATEWAY |
4,577 |
|
Datasheet | * | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
BCM3382GKFEBGDOCSIS 3.0 DATA MODEM |
3,922 |
|
Datasheet | * | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
BCM3382ZKFEBGDOCSIS 3.0 DATA MODEM |
4,883 |
|
Datasheet | * | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
BCM1122A4KEBUNIPROCESSOR SOC |
3,648 |
|
Datasheet | * | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
BCM1122A4KEBGUNIPROCESSOR SOC |
2,591 |
|
Datasheet | * | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
BCM3383DUIFEBGMODULE DATA MODEM |
1,013 |
|
Datasheet | - | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
BCM3383DUKFEBGMODULE DATA MODEM |
4,293 |
|
Datasheet | - | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
|
10AS016E3F27E1SGIC SOC CORTEX-A9 1.5GHZ 672FBGA |
1,425 |
|
Datasheet | Arria 10 SX | 672-BBGA, FCBGA | Tray | Discontinued at Digi-Key | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 160K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 672-FBGA, FC (27x27) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
