System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AGIB023R18A1E1VBIC FPGA AGILEX-I 1805BGA |
4,909 |
|
Datasheet | Agilex I | 1805-BBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1805-BGA (42.5x42.5) |
|
XCVC1502-2MLIVSVA2197IC VERSAL AI-CORE FPGA 2197BGA |
2,340 |
|
Datasheet | Versal™ AI Core | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ AI Core FPGA, 800k Logic Cells | -40°C ~ 110°C (TJ) | - | - | 2197-FCBGA (45x45) |
|
XCVC1502-2HSIVSVA2197XCVC1502-2HSIVSVA2197 |
3,973 |
|
Datasheet | Virtex® UltraScale+™ | 2197-BFBGA, FCBGA | Bulk | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz, 1.65GHz | Versal™ AI Core FPGA, 800k Logic Cells | -40°C ~ 110°C (TJ) | - | - | 2197-FCBGA (45x45) |
|
AGIB022R31A2E1VAGIB022R31A2E1V |
3,848 |
|
Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
AGIB022R31A1E2VAGIB022R31A1E2V |
2,320 |
|
Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
XCVE1752-2MLIVSVA2197IC VERSAL AI-CORE FPGA 2197BGA |
3,055 |
|
Datasheet | Versal™ AI Core | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ AI Edge FPGA, 1M Logic Cells | -40°C ~ 110°C (TJ) | - | - | 2197-FCBGA (45x45) |
|
XCVE1752-2HSIVSVA2197XCVE1752-2HSIVSVA2197 |
3,319 |
|
Datasheet | Virtex® UltraScale+™ | 2197-BFBGA, FCBGA | Bulk | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz, 1.65GHz | Versal™ AI Edge FPGA, 1M Logic Cells | -40°C ~ 110°C (TJ) | - | - | 2197-FCBGA (45x45) |
|
|
XCVC1802-1LSIVSVA2197IC VERSAL AICORE FPGA 2197BGA |
2,428 |
|
Datasheet | Versal™ AI Core | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ AI Core FPGA, 1.5M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
|
|
XCVC1802-2LSEVSVA2197IC VERSAL AICORE FPGA 2197BGA |
1,183 |
|
Datasheet | Versal™ AI Core | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 450MHz, 1.08GHz | Versal™ AI Core FPGA, 1.5M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
|
|
XCVC1802-1MLIVSVA2197IC VERSAL AICORE FPGA 2197BGA |
1,632 |
|
Datasheet | Versal™ AI Core | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.3GHz | Versal™ AI Core FPGA, 1.5M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
|
|
XCVC1802-2MLEVSVA2197IC VERSAL AICORE FPGA 2197BGA |
3,612 |
|
Datasheet | Versal™ AI Core | 2197-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ AI Core FPGA, 1.5M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 2197-FCBGA (45x45) |
|
|
XCZU48DR-2FSVE1156IIC ZUP RFSOC A53 FPGA 1156BGA |
4,162 |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
|
|
XCZU48DR-2FFVE1156IIC ZUP RFSOC A53 FPGA 1156BGA |
4,977 |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
|
|
XCVC1802-2MSIVSVD1760IC VERSAL AICORE FPGA 1760BGA |
3,399 |
|
Datasheet | Versal™ AI Core | 1760-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ AI Core FPGA, 1.5M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1760-FCBGA (40x40) |
|
AGID023R31B2E2VIC FPGA AGILEX-I 3184FBGA |
1,067 |
|
Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
AGID023R31B2E3EIC FPGA AGILEX-I 3184FBGA |
2,135 |
|
Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
AGID023R31B2E2VBIC FPGA AGILEX-I 3184BGA |
2,474 |
|
Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
|
XCZU49DR-L1FFVF1760IIC ZUP RFSOC A53 FPGA LP 1760BGA |
4,968 |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1760-FCBGA (42.5x42.5) |
|
|
XCZU49DR-2FFVF1760EIC ZUP RFSOC A53 FPGA 1760BGA |
4,418 |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1760-FCBGA (42.5x42.5) |
|
|
XCZU49DR-2FSVF1760EIC ZUP RFSOC A53 FPGA 1760BGA |
2,185 |
|
Datasheet | Zynq® UltraScale+™ RFSoC | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1760-FCBGA (42.5x42.5) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.