System On Chip (SoC)
Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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AGFA023R24C2E4XIC FPGA AGILEX-F 2340BGA |
2,587 |
|
Datasheet | Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
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AGFB027R25A2I3EIC FPGA AGILEX-F 2581FBGA |
4,835 |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
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AGFB027R25A2I2VIC FPGA AGILEX-F 2581FBGA |
3,413 |
|
Datasheet | Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
|
1SX250HN1F43I2LGIC FPGA STRATIX 10 1760FBGA |
1,561 |
|
Datasheet | Stratix® 10 SX | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1760-FBGA (42.5x42.5) |
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AGFC023R31C2E2VIC FPGA AGILEX-F 3184FBGA |
4,567 |
|
Datasheet | Agilex F | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
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AGFC023R31C2E3EIC FPGA AGILEX-F 3184FBGA |
1,154 |
|
Datasheet | Agilex F | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
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AGFC023R31C2E2VBIC FPGA AGILEX-F 3184BGA |
3,069 |
|
Datasheet | Agilex F | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
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AGFB023R24C2E4XIC FPGA AGILEX-F 2340BGA |
2,885 |
|
Datasheet | Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
|
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AGIB022R29A2E3VIC FPGA AGILEX-I 2957BGA |
4,215 |
|
Datasheet | Agilex I | 2957-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2957-BGA (56x45) |
|
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AGFD023R31C2E3EIC FPGA AGILEX-F 3184FBGA |
3,423 |
|
Datasheet | Agilex F | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
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AGFD023R31C2E2VIC FPGA AGILEX-F 3184FBGA |
3,471 |
|
Datasheet | Agilex F | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
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AGFD023R31C2E2VBIC FPGA AGILEX-F 3184BGA |
2,087 |
|
Datasheet | Agilex F | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
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1SX280HU3F50I3XGIC FPGA STRATIX 10 2397FBGA |
3,021 |
|
Datasheet | Stratix® 10 SX | 2397-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2397-FBGA, FC (50x50) |
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1SX280LU3F50I3XGASIC FPGA STRATIX 10 2397FBGA |
3,846 |
|
Datasheet | Stratix® 10 SX | 2397-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2397-FBGA, FC (50x50) |
|
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1SX280LU3F50I3XGIC FPGA STRATIX 10 2397FBGA |
1,166 |
|
Datasheet | Stratix® 10 SX | 2397-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2800K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2397-FBGA, FC (50x50) |
|
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1SX250HU1F50E2LGIC FPGA STRATIX 10 2397FBGA |
1,291 |
|
Datasheet | Stratix® 10 SX | 2397-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 2500K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 2397-FBGA, FC (50x50) |
|
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AGIB023R31B2I3VIC FPGA AGILEX-I 3184FBGA |
1,959 |
|
Datasheet | Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
|
XCVC1502-1LLIVSVA1596IC VERSAL AI-CORE FPGA 1596BGA |
4,924 |
|
Datasheet | Versal™ AI Core | 1596-BFBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ Prime FPGA, 80k Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1596-BGA (37.5x37.5) |
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XCVC1502-2LLEVSVA1596IC VERSAL AI-CORE FPGA 1596BGA |
1,744 |
|
Datasheet | Versal™ AI Core | 1596-BFBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 450MHz, 1.08GHz | Versal™ AI Core FPGA, 800k Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1596-BGA (37.5x37.5) |
|
XCVE1752-1LLINSVG1369IC VERSAL AI-EDGE FPGA 1369BGA |
4,946 |
|
Datasheet | Versal™ AI Core | 1369-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 400MHz, 1GHz | Versal™ AI Core FPGA, 1M Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1369-FCBGA (35x35) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
