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ELECTRONIC COMPONENTS

System On Chip (SoC)

Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
AGFA023R25A2I2V Intel

AGFA023R25A2I2V

IC FPGA AGILEX-F 2581FBGA

Intel

4,071
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFA023R24C2E2VB Intel

AGFA023R24C2E2VB

IC FPGA AGILEX-F 2340BGA

Intel

3,824
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA023R24C2E3E Intel

AGFA023R24C2E3E

IC FPGA AGILEX-F 2340BGA

Intel

1,909
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA023R24C2E2V Intel

AGFA023R24C2E2V

AGFA023R24C2E2V

Intel

1,073
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB023R25A2I2V Intel

AGFB023R25A2I2V

IC FPGA AGILEX-F 2581FBGA

Intel

2,639
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFB023R25A2I3E Intel

AGFB023R25A2I3E

IC FPGA AGILEX-F 2581FBGA

Intel

4,977
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements -40°C ~ 100°C (TJ) - - -
1SX250HH2F55I1VG Intel

1SX250HH2F55I1VG

IC FPGA STRATIX 10 2912FBGA

Intel

3,969
Datasheet Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
1SX250HH1F55I2VG Intel

1SX250HH1F55I2VG

IC FPGA STRATIX 10 2912FBGA

Intel

3,915
Datasheet Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
AGFB023R24C2E2VB Intel

AGFB023R24C2E2VB

IC FPGA AGILEX-F 2340BGA

Intel

2,669
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB023R24C2E3E Intel

AGFB023R24C2E3E

IC FPGA AGILEX-F 2340BGA

Intel

4,598
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB023R24C2E2V Intel

AGFB023R24C2E2V

AGFB023R24C2E2V

Intel

1,985
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
1SX250LH3F55E1VG Intel

1SX250LH3F55E1VG

IC SOC CORTEX-A53 1.5GHZ 2912BGA

Intel

3,133
Datasheet Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements 0°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
AGFC023R25A3E4X Intel

AGFC023R25A3E4X

IC FPGA AGILEX-F 2581FBGA

Intel

4,707
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - -
XCVC1502-2MSINSVG1369 AMD

XCVC1502-2MSINSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

1,139
Datasheet Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ AI Core FPGA, 800k Logic Cells -40°C ~ 110°C (TJ) - - 1369-FCBGA (35x35)
AGFD023R25A3E4X Intel

AGFD023R25A3E4X

IC FPGA AGILEX-F 2581FBGA

Intel

2,576
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - -
XCVP1202-3HSEVSVA2785 AMD

XCVP1202-3HSEVSVA2785

IC VERSAL AI-CORE FPGA 2785BGA

AMD

4,461
Datasheet Versal® Premium 2785-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz, 1.7GHz Versal™ Premium FPGA, 2M Logic Cells 0°C ~ 100°C (TJ) - - 2785-FCBGA (50x50)
1SX250LN2F43I1VG Intel

1SX250LN2F43I1VG

IC SOC CORTEX-A53 1.5GHZ 1760BGA

Intel

1,576
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA, FC (42.5x42.5)
1SX250HN1F43I2VG Intel

1SX250HN1F43I2VG

IC FPGA STRATIX 10 1760FBGA

Intel

1,501
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX250HN2F43I1VG Intel

1SX250HN2F43I1VG

IC FPGA STRATIX 10 1760FBGA

Intel

1,776
Datasheet Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
AGFC019R25A2E4X Intel

AGFC019R25A2E4X

IC FPGA AGILEX-F 2581FBGA

Intel

3,379
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - -
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FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

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