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ELECTRONIC COMPONENTS

System On Chip (SoC)

Explore System On Chip (SoC) parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.

For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
1SX210HU2F50E2VG Intel

1SX210HU2F50E2VG

IC FPGA STRATIX 10 2397FBGA

Intel

2,085
Datasheet Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2100K Logic Elements 0°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
AGFA023R31C3E3E Intel

AGFA023R31C3E3E

IC FPGA AGILEX-F 3184FBGA

Intel

4,455
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFB023R31C3E3E Intel

AGFB023R31C3E3E

IC FPGA AGILEX-F 3184FBGA

Intel

3,022
Datasheet Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFB014R24D2I2V Intel

AGFB014R24D2I2V

IC FPGA AGILEX-F 2340FBGA

Intel

4,744
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.4M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFA027R31C3E3V Intel

AGFA027R31C3E3V

IC FPGA AGILEX-F 3184FBGA

Intel

1,655
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB027R31C3E3V Intel

AGFB027R31C3E3V

IC FPGA AGILEX-F 3184FBGA

Intel

1,044
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFC019R24C2E3V Intel

AGFC019R24C2E3V

IC FPGA AGILEX-F 2340BGA

Intel

3,256
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFC019R24C3I3E Intel

AGFC019R24C3I3E

IC FPGA AGILEX-F 2340BGA

Intel

4,149
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFD019R24C3I3E Intel

AGFD019R24C3I3E

IC FPGA AGILEX-F 2340BGA

Intel

1,977
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFD019R24C2E3V Intel

AGFD019R24C2E3V

IC FPGA AGILEX-F 2340BGA

Intel

4,439
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
XCZU55DR-L1FSVE1156I AMD

XCZU55DR-L1FSVE1156I

IC ZUP RFSOC A53 FPGA LP 1156BGA

AMD

3,263
Datasheet Zynq® UltraScale+™ RFSoC DR 1156-BBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - - DDR, DMA, PCIe, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq® UltraScale+™ RFSoC -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU55DR-L1FFVE1156I AMD

XCZU55DR-L1FFVE1156I

IC ZUP RFSOC A53 FPGA LP 1156BGA

AMD

1,999
Datasheet Zynq® UltraScale+™ RFSoC DR 1156-BBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - - DDR, DMA, PCIe, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq® UltraScale+™ RFSoC -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
AGFA012R24C2E1V Intel

AGFA012R24C2E1V

IC FPGA AGILEX-F 2340FBGA

Intel

3,205
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA012R24C2E1VB Intel

AGFA012R24C2E1VB

IC FPGA AGILEX-F 2340BGA

Intel

1,030
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
1SX165HU2F50I2VG Intel

1SX165HU2F50I2VG

IC FPGA STRATIX 10 2397FBGA

Intel

2,536
Datasheet Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 1650K Logic Elements -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
AGFB012R24C2E1V Intel

AGFB012R24C2E1V

IC FPGA AGILEX-F 2340FBGA

Intel

4,591
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB012R24C2E1VB Intel

AGFB012R24C2E1VB

IC FPGA AGILEX-F 2340BGA

Intel

2,345
Datasheet Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.2M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGIB022R31A3E3V Intel

AGIB022R31A3E3V

IC FPGA AGILEX-I 3184BGA

Intel

4,956
Datasheet Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFA014R24C2E2V Intel

AGFA014R24C2E2V

IC FPGA AGILEX-F 2340FBGA

Intel

4,743
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.4M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA014R24C2E3E Intel

AGFA014R24C2E3E

IC FPGA AGILEX-F 2340FBGA

Intel

3,850
Datasheet Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.4M Logic Elements 0°C ~ 100°C (TJ) - - -
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FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

BOM & COMPONENT SOURCING

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