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System On Chip (SoC)

Review System On Chip (SoC) Embedded components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Architecture Core Processor Flash Size RAM Size Peripherals Connectivity Speed Primary Attributes Operating Temperature Grade Qualification Supplier Device Package
XCVP1502-1MSEVSVA3340 AMD

XCVP1502-1MSEVSVA3340

IC VERSAL PREM ACAP FPGA 3340BGA

AMD

3,167
Datasheet Versal® Premium 3340-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ Premium FPGA, 3.7M Logic Cells 0°C ~ 100°C (TJ) - - 3340-FCBGA (55x55)
XCZU48DR-1FFVE1156I AMD

XCZU48DR-1FFVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

2,335
Datasheet Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU48DR-1FSVE1156I AMD

XCZU48DR-1FSVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

1,797
Datasheet Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCVE2602-2HSINSVH1369 AMD

XCVE2602-2HSINSVH1369

XCVE2602-2HSINSVH1369

AMD

2,501
Datasheet - - Bulk Active - - - - - - - - - - - -
XCVC1702-2LSENSVG1369 AMD

XCVC1702-2LSENSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

1,037
Datasheet Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ AI Core FPGA, 1M Logic Cells 0°C ~ 100°C (TJ) - - 1369-FCBGA (35x35)
XCVC1702-1LSINSVG1369 AMD

XCVC1702-1LSINSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

1,139
Datasheet Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ AI Core FPGA, 1M Logic Cells -40°C ~ 100°C (TJ) - - 1369-FCBGA (35x35)
XCVC1702-1MLINSVG1369 AMD

XCVC1702-1MLINSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

1,583
Datasheet Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ AI Core FPGA, 1M Logic Cells -40°C ~ 110°C (TJ) - - 1369-FCBGA (35x35)
XCVC1702-2MLENSVG1369 AMD

XCVC1702-2MLENSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

3,501
Datasheet Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ AI Core FPGA, 1M Logic Cells 0°C ~ 110°C (TJ) - - 1369-FCBGA (35x35)
XCZU43DR-2FSVE1156I AMD

XCZU43DR-2FSVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

2,575
Datasheet Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU47DR-2FFVE1156I AMD

XCZU47DR-2FFVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

3,202
Datasheet Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
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FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.

PART MATCHING & SOURCING

Need Help Narrowing Down the Right System On Chip (SoC) Part?

Send your target specifications, preferred manufacturer, quantity or reference part number. Our team can help check matching options, availability and quotation details for your sourcing requirement.

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