System On Chip (SoC)

Review System On Chip (SoC) Embedded components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.

If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Package/Case	Packaging	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Grade	Qualification	Supplier Device Package
XCZU7EV-3FBVB900E IC SOC CORTEX-A53 900FCBGA AMD	2,929	5201.67	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EV	900-BBGA, FCBGA	Tray	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.5GHz	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	0°C ~ 100°C (TJ)	-	-	900-FCBGA (31x31)
XCZU9EG-L2FFVB1156E IC SOC CORTEX-A53 1156FCBGA AMD	2,776	5202.90	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	1156-BBGA, FCBGA	Bulk	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 600MHz, 1.3GHz	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	0°C ~ 100°C (TJ)	-	-	1156-FCBGA (35x35)
XCVM1302-2MSIVSVD1760 IC VERSALPRIME ACAP FPGA 1760BGA AMD	2,416	5635.86	RFQ	Datasheet	Versal™ Prime	1760-BFBGA, FCBGA	Tray	Active	MPU, FPGA	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.4GHz	Versal™ Prime FPGA, 70k Logic Cells	-40°C ~ 100°C (TJ)	-	-	1760-FCBGA (40x40)
XAZU11EG-1FFVF1517I IC ZUS MPSOC FPGA 1517FCBGA AMD	4,997	5239.80	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	1517-BBGA, FCBGA	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 600MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	-40°C ~ 100°C (TJ)	-	-	1517-FCBGA (40x40)
XCZU11EG-2FFVC1156E IC SOC CORTEX-A53 1156FCBGA AMD	1,836	5257.02	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	1156-BBGA, FCBGA	Tray	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 600MHz, 1.3GHz	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	0°C ~ 100°C (TJ)	-	-	1156-FCBGA (35x35)
XCZU11EG-L1FFVC1156I IC SOC CORTEX-A53 1156FCBGA AMD	2,250	5257.02	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	1156-BBGA, FCBGA	Tray	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 600MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	-40°C ~ 100°C (TJ)	-	-	1156-FCBGA (35x35)
XCZU17EG-1FFVC1760E IC SOC CORTEX-A53 1760FCBGA AMD	4,603	5329.59	RFQ	Datasheet	Zynq® UltraScale+™ MPSoC EG	1760-BBGA, FCBGA	Tray	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 600MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells	0°C ~ 100°C (TJ)	-	-	1760-FCBGA (42.5x42.5)
XCVM1302-2LLENBVB1024 IC VERSALPRIME ACAP FPGA 1024BGA AMD	3,492	5795.76	RFQ	Datasheet	Versal™ Prime	1024-BFBGA	Tray	Active	MPU, FPGA	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	450MHz, 1.08GHz	Versal™ Prime FPGA, 70k Logic Cells	0°C ~ 100°C (TJ)	-	-	1024-BGA (31x31)
XCVM1302-1LLINBVB1024 IC VERSALPRIME ACAP FPGA 1024BGA AMD	1,158	5795.76	RFQ	Datasheet	Versal™ Prime	1024-BFBGA	Tray	Active	MPU, FPGA	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	400MHz, 1GHz	Versal™ Prime FPGA, 70k Logic Cells	-40°C ~ 100°C (TJ)	-	-	1024-BGA (31x31)
XCVM1402-1MSEVSVD1760 IC VERSALPRIME ACAP FPGA 1760BGA AMD	3,540	5837.58	RFQ	Datasheet	Versal™ Prime	1760-BFBGA, FCBGA	Tray	Active	MPU, FPGA	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.3GHz	Versal™ Prime FPGA, 1.2M Logic Cells	0°C ~ 100°C (TJ)	-	-	1760-FCBGA (40x40)

FAQ

Frequently Asked Questions

What are System On Chip (SoC) components used for?

System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.

How do I choose the right System On Chip (SoC) part?

Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.

Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?

Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.

How can I request pricing and availability?

Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.