System On Chip (SoC)
Review System On Chip (SoC) Embedded components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.
If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Grade | Qualification | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XCZU4EG-2FBVB900IIC SOC CORTEX-A53 900FCBGA |
1,095 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
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XCZU4EG-L2FBVB900EIC SOC CORTEX-A53 900FCBGA |
4,027 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EG | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
XC7Z035-3FFG676EIC SOC CORTEX-A9 800MHZ 676FCBGA |
4,134 |
|
Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1GHz | Kintex™-7 FPGA, 275K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
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XC7Z035-L2FFG676IIC SOC CORTEX-A9 800MHZ 676FCBGA |
3,033 |
|
Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 275K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
|
XCZU5CG-2SFVC784IIC SOC CORTEX-A53 784FCBGA |
1,764 |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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XCZU5CG-L2SFVC784EIC SOC CORTEX-A53 784FCBGA |
2,719 |
|
Datasheet | Zynq® UltraScale+™ MPSoC CG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
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XC7Z045-2FFG676EIC SOC CORTEX-A9 800MHZ 676FCBGA |
1,942 |
|
Datasheet | Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 350K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
|
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XCZU5EV-1FBVB900EIC SOC CORTEX-A53 900FCBGA |
2,594 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EV | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
|
XCZU5EV-2SFVC784EIC SOC CORTEX-A53 784FCBGA |
2,950 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EV | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
|
XCZU5EV-L1SFVC784IIC SOC CORTEX-A53 784FCBGA |
4,085 |
|
Datasheet | Zynq® UltraScale+™ MPSoC EV | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
Frequently Asked Questions
What are System On Chip (SoC) components used for?
System On Chip (SoC) components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right System On Chip (SoC) part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find System On Chip (SoC) parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
