ELECTRONIC COMPONENTS
Microprocessors
Explore Microprocessors parts from multiple manufacturers, with model information, availability, datasheets and technical specifications for engineering and purchasing.
For parts that are not shown in the list, send the manufacturer part number, quantity or BOM to JIEXIN Electronics. Our team can assist with availability checks and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Package/Case | Series | Packaging | Product Status | Core Processor | Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Grade | Qualification | Security Features | Mounting Type | Supplier Device Package | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SM750GX000000-ACIC MPU LYNXEXP 300MHZ 265BGA |
1,350 |
|
Datasheet | 265-LFBGA | LynxExp | Bulk | Active | LynxExpress | 1 Core | 300MHz | - | DDR | Yes | DMA, DVO, TMDS, LVDS | - | - | USB 3.0 | - | 0°C ~ 70°C | - | - | - | Surface Mount | 265-BGA (17x17) | GPIO, I2C, SSP, PCI |
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STM32MP157AAC3IC MPU STM32MP1 650MHZ 361TFBGA |
3,852 |
|
Datasheet | 361-TFBGA | STM32MP1 | Tray | Active | ARM® Cortex®-A7 | 2 Core, 32-Bit | 209MHz, 650MHz | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2, LPDDR3 | Yes | HDMI-CEC, LCD | 10/100Mbps, GbE | - | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | 2.5V, 3.3V | -40°C ~ 125°C (TJ) | - | - | ARM TZ | Surface Mount | 361-TFBGA (12x12) | CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB |
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STM32MP157AAB3TIC MPU STM32MP1 650MHZ 354LFBGA |
4,879 |
|
Datasheet | 354-LFBGA | STM32MP1 | Tape & Reel (TR) | Active | ARM® Cortex®-A7 | 2 Core, 32-Bit | 209MHz, 650MHz | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2, LPDDR3 | Yes | HDMI-CEC, LCD | 10/100Mbps, GbE | - | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | 2.5V, 3.3V | -40°C ~ 125°C (TJ) | - | - | ARM TZ | Surface Mount | 354-LFBGA (16x16) | CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB |
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STM32MP157AAB3IC MPU STM32MP1 650MHZ 354LFBGA |
3,838 |
|
Datasheet | 354-LFBGA | STM32MP1 | Tray | Active | ARM® Cortex®-A7 | 2 Core, 32-Bit | 209MHz, 650MHz | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2, LPDDR3 | Yes | HDMI-CEC, LCD | 10/100Mbps, GbE | - | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | 2.5V, 3.3V | -40°C ~ 125°C (TJ) | - | - | ARM TZ | Surface Mount | 354-LFBGA (16x16) | CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB |
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STM32MP157DAB1IC MPU STM32MP1 800MHZ 354LFBGA |
3,554 |
|
Datasheet | 354-LFBGA | STM32MP1 | Tray | Active | ARM® Cortex®-A7 | 2 Core, 32-Bit | 209MHz, 800MHz | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2, LPDDR3 | Yes | HDMI-CEC, LCD | 10/100Mbps, GbE | - | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | 2.5V, 3.3V | -20°C ~ 105°C (TJ) | - | - | ARM TZ | Surface Mount | 354-LFBGA (16x16) | CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB |
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MCIMX233DJM4CR2IC MPU I.MX23 454MHZ 169MAPBGA |
1,259 |
|
Datasheet | 169-LFBGA | i.MX23 | Tape & Reel (TR) | Active | ARM926EJ-S | 1 Core, 32-Bit | 454MHz | Data; DCP | DRAM | No | LCD, Touchscreen | - | - | USB 2.0 + PHY (1) | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -10°C ~ 70°C (TA) | - | - | Cryptography, Hardware ID | Surface Mount | 169-MAPBGA (11x11) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
.JPG "AM3356BZCZA60")
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AM3356BZCZA60IC MPU SITARA 600MHZ 324NFBGA |
2,631 |
|
Datasheet | 324-LFBGA | Sitara™ | Tray | Active | ARM® Cortex®-A8 | 1 Core, 32-Bit | 600MHz | Multimedia; NEON™ SIMD | LPDDR, DDR2, DDR3, DDR3L | Yes | LCD, Touchscreen | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | -40°C ~ 105°C (TJ) | - | - | Cryptography, Random Number Generator | Surface Mount | 324-NFBGA (15x15) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART |
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MCIMX6L2EVN10ACIC MPU I.MX6SL 1.0GHZ 432MAPBGA |
4,378 |
|
Datasheet | 432-TFBGA | i.MX6SL | Tray | Active | ARM® Cortex®-A9 | 1 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | -40°C ~ 105°C (TA) | - | - | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Surface Mount | 432-MAPBGA (13x13) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
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MCIMX6X2AVN08ABIC MPU I.MX6SX 800MHZ 400MAPBGA |
4,996 |
|
Datasheet | 400-LFBGA | i.MX6SX | Tray | Not For New Designs | ARM® Cortex®-A9, ARM® Cortex®-M4 | 2 Core, 32-Bit | 200MHz, 800MHz | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | -40°C ~ 125°C (TJ) | - | - | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Surface Mount | 400-MAPBGA (17x17) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART |
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MCIMX31DVMN5DIC MPU I.MX31 532MHZ 473LFBGA |
2,849 |
|
Datasheet | 473-LFBGA | i.MX31 | Tray | Active | ARM1136JF-S | 1 Core, 32-Bit | 532MHz | Multimedia; GPU, IPU, MPEG-4, VFP | DDR | Yes | Keyboard, Keypad, LCD | - | - | USB 2.0 (3) | 1.8V, 2.0V, 2.5V, 2.7V, 3.0V | -20°C ~ 70°C (TA) | - | - | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Surface Mount | 473-LFBGA (19x19) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART |
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OMAP3530ECBBALPDIC MPU OMAP-35XX 600MHZ 515FCBGA |
2,257 |
|
Datasheet | 515-VFBGA, FCBGA | OMAP-35xx | Tray | Active | ARM® Cortex®-A8 | 1 Core, 32-Bit | 600MHz | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LPDDR | Yes | LCD | - | - | USB 1.x (3), USB 2.0 (1) | 1.8V, 3.0V | -40°C ~ 105°C (TJ) | - | - | - | Surface Mount | 515-POP-FCBGA (12x12) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART |
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MCIMX6DP5EYM1AAIC MPU I.MX6DP 1.0GHZ 624FCPBGA |
1,737 |
|
Datasheet | 624-LFBGA, FCBGA | i.MX6DP | Tray | Active | ARM® Cortex®-A9 | 2 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | - | - | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | Surface Mount | 624-FCPBGA (21x21) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
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T1042NXE7MQBIC MPU QORIQ T1 1.4GHZ 780FCPBGA |
4,914 |
|
Datasheet | 780-FBGA, FCBGA | QorIQ T1 | Bulk | Active | PowerPC e5500 | 4 Core, 64-Bit | 1.4GHz | - | DDR3L/4 | No | - | 1Gbps (5) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | - | - | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | Surface Mount | 780-FCPBGA (23x23) | I2C, MMC/SD, PCIe, SPI, UART |
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AM5718AZBOXEMIC MPU SITARA 1.5GHZ 780FCBGA |
2,362 |
|
Datasheet | 780-BGA, FCBGA | Sitara™ | Tray | Active | ARM® Cortex®-A15 | 1 Core, 32-Bit | 1.5GHz | DSP, BB2D, IPU, IVA, GPU, VPE | DDR3, DDR3L | Yes | - | - | SATA 3Gbps (1) | USB 2.0 (2), USB 3.0 (2) + PHY (2) | 1.8V, 3.3V | -55°C ~ 125°C | - | - | - | Surface Mount | 780-FCBGA (23x23) | CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART |
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LS1088AXE7MQAIC MPU QORIQ 1.2GHZ 780FBGA |
4,067 |
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Datasheet | 780-BFBGA, FCBGA | QorIQ® Layerscape | Tray | Active | ARM® Cortex®-A53 | 8 Core, 64-Bit | 1.2GHz | - | DDR4 | - | - | 10GbE (2), 1GbE (8) | SATA 6Gbps (1) | USB 3.0 (2) + PHY | - | -40°C ~ 105°C | - | - | Secure Boot, TrustZone® | Surface Mount | 780-FBGA (23x23) | - |
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OMAPL137BPTPHIC MPU OMAP-L1X 300MHZ 176HLQFP |
4,250 |
|
Datasheet | 176-LQFP Exposed Pad | OMAP-L1x | Tray | Active | ARM926EJ-S | 1 Core, 32-Bit | 300MHz | Signal Processing; C674x, System Control; CP15 | SDRAM | No | LCD | 10/100Mbps (1) | - | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1.8V, 3.3V | -55°C ~ 175°C (TJ) | - | - | - | Surface Mount | 176-HLQFP (24x24) | HPI, I2C, McASP, MMC/SD, SPI, UART |
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STM32MP131AAG3Linear IC's |
4,049 |
|
Datasheet | 289-TFBGA | STM32MP1 | Tray | Active | ARM® Cortex®-A7 | 1 Core, 32-Bit | 650MHz | Multimedia; NEON™ SIMD | DDR3, DDR3L, LPDDR2, LPDDR3 | Yes | LCD | 10/100/1000Mbps (1) | - | USB 2.0 (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TJ) | - | - | AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage | Surface Mount | 289-TFBGA (9x9) | GPIO, I2C, I2S, IrDA, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB |
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STM32MP131DAG7Linear IC's |
2,498 |
|
Datasheet | 289-TFBGA | STM32MP1 | Tray | Active | ARM® Cortex®-A7 | 1 Core, 32-Bit | 1GHz | Multimedia; NEON™ SIMD | DDR3, DDR3L, LPDDR2, LPDDR3 | Yes | LCD | 10/100/1000Mbps (1) | - | USB 2.0 (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TJ) | - | - | AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage | Surface Mount | 289-TFBGA (9x9) | GPIO, I2C, I2S, IrDA, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB |
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STM32MP133AAG3Linear IC's |
3,341 |
|
Datasheet | 289-TFBGA | STM32MP1 | Tray | Active | ARM® Cortex®-A7 | 1 Core, 32-Bit | 650MHz | Multimedia; NEON™ SIMD | DDR3, DDR3L, LPDDR2, LPDDR3 | Yes | LCD | 10/100/1000Mbps (2) | - | USB 2.0 (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TJ) | - | - | AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage | Surface Mount | 289-TFBGA (9x9) | CANbus, GPIO, I2C, I2S, IrDA, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART |
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STM32MP133DAG7Linear IC's |
4,211 |
|
Datasheet | 289-TFBGA | STM32MP1 | Tray | Active | ARM® Cortex®-A7 | 1 Core, 32-Bit | 1GHz | Multimedia; NEON™ SIMD | DDR3, DDR3L, LPDDR2, LPDDR3 | Yes | LCD | 10/100/1000Mbps (2) | - | USB 2.0 (2) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TJ) | - | - | AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage | Surface Mount | 289-TFBGA (9x9) | CANbus, GPIO, I2C, I2S, IrDA, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART |
FAQ
Frequently Asked Questions
What are Microprocessors components used for?
Microprocessors components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
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Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
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