Microcontrollers
Review Microcontrollers Embedded components in this filtered selection. Compare manufacturer information, availability, pricing, datasheets and key specifications to narrow down suitable parts for your application.
If the exact part or specification you need is not listed, send the manufacturer part number, target parameters and quantity to JIEXIN Electronics for sourcing and quotation support.
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Package/Case | Series | Packaging | Product Status | Programmable | Core Processor | Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
CYT3DLBBEBQ1BZSGSIC MCU 32BIT 4.063MB FLSH 272BGA |
960 |
|
Datasheet | 272-LFBGA | Traveo™ T2G | Tray | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Dual-Core | 240MHz | DMA, I2S, LVD, Temp Sensor, WDT | DMA, I2S, LVD, Temp Sensor, WDT | 135 | 4.063MB (4.063M x 8) | FLASH | 128K x 8 | 384K x 8 | 2.7V ~ 5.5V | - | - | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
CYT4BFCCHDQ0BZEGSIC MCU 32BT 8.1875MB FLSH 320BGA |
900 |
|
Datasheet | 320-LFBGA | Traveo™ T2G | Tray | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M4F | 32-Bit Quad-Core | 100MHz, 350MHz | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 240 | 8.1875MB (8.1875M x 8) | FLASH | 256 x 8 | 1M x 8 | 2.7V ~ 5.5V | A/D 114x12b SAR | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
|
|
CYT3DLBBGBQ1BZSGSIC MCU 32BIT 4.063MB FLSH 272BGA |
960 |
|
Datasheet | 272-LFBGA | Traveo™ T2G | Tray | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Dual-Core | 240MHz | DMA, I2S, LVD, Temp Sensor, WDT | DMA, I2S, LVD, Temp Sensor, WDT | 135 | 4.063MB (4.063M x 8) | FLASH | 128K x 8 | 384K x 8 | 2.7V ~ 5.5V | - | - | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
TC233LP32F200FACKXUMA1IC MCU 32BIT 2MB FLASH 100TQFP |
993 |
|
Datasheet | 100-TQFP Exposed Pad | AURIX™ | Tape & Reel (TR) | Active | Not Verified | TriCore™ | 32-Bit Single-Core | 200MHz | CANbus, FlexRay, LINbus, QSPI | DMA, WDT | 78 | 2MB (2M x 8) | FLASH | 128K x 8 | 192K x 8 | 3.3V | A/D 24x12b | External | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
|
CYT4A0100DQ0AESGSIC MCU |
400 |
|
Datasheet | - | - | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
CYT4BF8CEDQ0AESGSIC MCU 32BT 8.1875MB FLSH 176QFP |
398 |
|
Datasheet | 176-LQFP Exposed Pad | Traveo™ T2G | Tray | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M4F | 32-Bit Quad-Core | 100MHz, 350MHz | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 148 | 8.1875MB (8.1875M x 8) | FLASH | 256 x 8 | 1M x 8 | 2.7V ~ 5.5V | A/D 99x12b SAR | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
|
TC234LP32F200FACKXUMA1IC MCU 32BIT 2MB FLASH 144TQFP |
680 |
|
Datasheet | 144-LQFP Exposed Pad | AURIX™ | Tape & Reel (TR) | Active | Not Verified | TriCore™ | 32-Bit Single-Core | 200MHz | CANbus, FlexRay, LINbus, QSPI | DMA, WDT | 120 | 2MB (2M x 8) | FLASH | 128K x 8 | 192K x 8 | 3.3V | A/D 24x12b | External | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
|
TC212S8F133SCACKXUMA1IC MCU 32BIT 512KB FLASH 80TQFP |
1,800 |
|
Datasheet | 80-TQFP Exposed Pad | AURIX™ | Tape & Reel (TR) | Active | Not Verified | TriCore™ | 32-Bit Single-Core | 133MHz | CANbus, LINbus, QSPI | DMA, WDT | 59 | 512KB (512K x 8) | FLASH | 64K x 8 | 56K x 8 | 3.3V | A/D 24x12b | External | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
|
CYT4DNJBRCQ1BZSGSIC MCU 32BIT 6.188MB FLSH 327BGA |
876 |
|
Datasheet | 327-BGA | Traveo™ T2G | Tray | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Quad-Core | 320MHz | DMA, I2S, LVD, Temp Sensor, WDT | DMA, I2S, LVD, Temp Sensor, WDT | 168 | 6.188MB (6.188M x 8) | FLASH | 128K x 8 | 640K x 8 | 2.7V ~ 5.5V | - | - | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
S6J32LELSMSC20000TRAVEO-55NM |
400 |
|
Datasheet | 216-LQFP Exposed Pad | Traveo S6J3200 | Tray | Active | - | ARM® Cortex®-R5F | 32-Bit | 240MHz | CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128 | 4.171875MB (4.171875M x 8) | FLASH | - | 3M x 8 | 1.15V ~ 5.5V | A/D 50x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount |
Frequently Asked Questions
What are Microcontrollers components used for?
Microcontrollers components are used in a wide range of electronic equipment and systems. Their exact function depends on the device, circuit design and technical requirements of the application.
How do I choose the right Microcontrollers part?
Compare the manufacturer part number, key specifications, package type, operating conditions, availability and datasheet information. For replacement projects, always verify the critical electrical and mechanical parameters before selecting an alternative.
Can JIEXIN Electronics help source obsolete or hard-to-find Microcontrollers parts?
Yes. Send us the required manufacturer part number, quantity or BOM. Our sourcing team can help check stock availability, lead time, alternative sourcing options and quotation details.
How can I request pricing and availability?
Submit the part number, manufacturer and required quantity through our RFQ form. JIEXIN Electronics will review your request and provide available stock, pricing and sourcing information.
